Cooler Master HTK-002-U1 thermally conductive
compounds are grease-like silicone materials,
heavily filled with heat conductive metal oxides.
This combination promotes high thermal
conductivity, low bleed and high-temperature
stability. These compounds resist changes in
consistency at temperatures up to 177°C (350°F),
maintaining a positive heat sink seal to improve
heat transfer from the electronic device to the
heat sink or chassis, thereby, increasing the
overall efficiency of the device.